DIE BONDER AND DIE BONDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a die bonder and a die bonding method having a short tact time and a high alignment accuracy by reducing the impact of vibration generated by conveyance operation or airflow produced by a heat source on an image captured for the purpose of positioning a work or a wafer.

SOLUTION: Immediately after stopping the movement of a work or a die, an image pick-up device captures the image of the work or die in a shutter speed sufficiently longer than the fluctuation period (1 wavelength) of the waveform of a vibration before reaching a setting position and sufficiently longer than the wavelength of optical fluctuation due to airflow. An image processing section corrects the position by performing image processing where a blurred image thus captured is used for pattern matching.

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