发明名称 SURFACE TREATMENT METHOD FOR WAFER, AND PRODUCTION METHOD
摘要 <p>Provided is a surface treatment method whereby a textured structure is formed at a high yield on the surface of a semiconductor wafer functioning as the light-receiving surface of a solar cell. A semiconductor wafer is obtained by slicing an ingot grown by means of the Czochralski process. The surface of the wafer, which functions as the light-receiving surface of a solar cell, is coated with a water-soluble polymer solution such as polyvinyl alcohol. Subsequently, the surface of the wafer is subjected to etching treatment in an aqueous alkali solution such as potassium hydroxide.</p>
申请公布号 WO2012036177(A1) 申请公布日期 2012.03.22
申请号 WO2011JP70915 申请日期 2011.09.07
申请人 SUMCO CORPORATION;OKUUCHI, SHIGERU 发明人 OKUUCHI, SHIGERU
分类号 H01L31/04;H01L21/306 主分类号 H01L31/04
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