发明名称 MODULAR INPUT/OUTPUT BRIDGE SYSTEM FOR SEMICONDUCTOR PROCESSING EQUIPMENT
摘要 Apparatus and methods for providing an interface for a semiconductor processing tool are provided. In some embodiments, the apparatus may include an input/output bridge for receiving analog and state command system control signals from, and sending return data and status information to, a system controller, wherein the analog and state command system control signals are intended to control an analog device, and for converting the analog and state command system control signal into a digital system control signal intended to control a digital device; and an upper pneumatic assembly coupled to the input/output bridge for providing pressure control to one or more pressure zones located on a polishing apparatus coupled to the upper pneumatic assembly for the polishing of semiconductor wafers.
申请公布号 KR20120028322(A) 申请公布日期 2012.03.22
申请号 KR20117029295 申请日期 2010.05.07
申请人 APPLIED MATERIALS, INC. 发明人 SCHAUER RONALD V.
分类号 H01L21/304 主分类号 H01L21/304
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