ELECTRONIC PACKAGING WITH A VARIABLE THICKNESS MOLD CAP
摘要
An electronic package with improved warpage compensation. The electronic package includes a mold cap having a variable thickness. The variable thickness can have a mound or dimple design. In another embodiment, a method is provided for reducing unit warpage of an electronic package by designing the topography of a mold cap to compensate for warpage.
申请公布号
WO2012037263(A1)
申请公布日期
2012.03.22
申请号
WO2011US51612
申请日期
2011.09.14
申请人
QUALCOMM INCORPORATED;RAMADOSS, VIVEK;JHA, GOPAL C.;HEALY, CHRISTOPHER J.
发明人
RAMADOSS, VIVEK;JHA, GOPAL C.;HEALY, CHRISTOPHER J.