| 摘要 |
The present invention relates to a method for plating a surface of a copper (110) circuit formed on a surface of a printed circuit board (100), wherein the method comprises: a first step of performing a primary displacement-plating process on the surface of the copper (110) circuit formed on the surface of the printed circuit board (100), using silver (120) or a silver alloy serving as a diffusion barrier layer; and a second step of performing a secondary displacement-plating process on the silver (120) or the silver alloy primarily displacement-plated on the surface of the copper (110) circuit, using tin (130) or a tin alloy serving as a protective layer for protecting the silver (120) or the silver alloy, to thereby form a double layer. According to the present invention, the generation of intermetallic compounds, the generation of whisker and short circuits resulting therefrom, surface oxidation, silver-ion migration, etc. can be prevented. |
