INTEGRATED CIRCUIT ESD PROTECTION USING SUBSTRATE IN ESD CURRENT PATH

摘要

A method for conducting ESD current through an integrated circuit formed on a semiconductor substrate includes sensing an ESD potential between a first I/O pad and a second I/O pad of the integrated circuit, providing a current path for ESD current from the first I/O pad of the integrated circuit to a portion of a first metal line in the integrated circuit, providing a current path for ESD current from the portion of the first metal line to the substrate, and providing a current path for ESD current from the substrate to the second I/O pad of the integrated circuit.