| 摘要 |
<p>PURPOSE: A method for manufacturing a stack package is provided to prevent cracks on the boundary surface between a chip and a molding material, thereby increasing reliability between the molding material and a pre-package molding material. CONSTITUTION: A semiconductor chip(200) is stacked on an interposer wafer to electrically connect a through silicon via with a through electrode of a semiconductor electrode. The semiconductor chip and the interposer wafer are molded by a molding material. The thickness of the molding material is reduced by eliminating an upper part of the molding material. The upper part of the molding material is etched to expose all or a portion of an upper part of the semiconductor chip.</p> |
