APPARATUS FOR RECEVING WAFER AND DEPOSITION APPARATUS HAVING THE SAME

摘要

PURPOSE: A wafer receiving device and a deposition device with the same are provided to easily eliminate an air layer between a wafer and a first support unit, thereby minimizing damage of the wafer due to movement of the wafer. CONSTITUTION: A first support unit(110) supports a wafer. A second support unit(120) surrounds the wafer. A wafer receiving groove(111) receives a wafer by the first support unit and the second support unit. A plurality of exhaust grooves are extended from the wafer receiving groove and formed on the second support unit. The exhaust grooves are extended from an inner side of the wafer receiving groove to an external side of the second support unit. The first support unit and the second support unit include silicon carbide. The first support unit is integrated with the second support unit.