| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cutting grinding wheel capable of cutting even a hard brittle material like a sapphire wafer without generating chipping. <P>SOLUTION: This cutting grinding wheel is composed by adding a boron compound to diamond abrasive grain. The boron compound is selected from a group consisting of B<SB POS="POST">4</SB>C, HBN and CBN. <P>COPYRIGHT: (C)2012,JPO&INPIT |
