| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive film for circuit connections, excellent in connection processability when connecting between circuit materials, and to provide a circuit connection structure. <P>SOLUTION: The adhesive film for circuit connections includes: a curing agent which generates free radicals by heating; a radically polymerizable material; a film forming polymer; and conductive particles. As the radically polymerizable material, a urethane acrylate and/or urethane methacrylate having a viscosity at 25°C of 100,000-1,000,000 mPa s, and a urethane acrylate and or a urethane (meth)acrylate having a dicyclopentenyl group or a tricyclo decanyl group are contained. The film forming polymer of 80-180 pts.wt. is incorporated with the radically polymerizable material of 100 pts.wt. <P>COPYRIGHT: (C)2012,JPO&INPIT |
