| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a die bonder that improves the pickup accuracy and productivity. <P>SOLUTION: A die bonder and a die-bonding method include an image processing apparatus in which a transfer tool 403 is rotated by a rotation mechanism 408 by a predetermined rotation angle, the bottom surface of the transfer tool 403 is photographed by a camera 405 per rotation angle, the rotation center of the transfer tool 403 is calculated from the photographed image and the deviation amount θ per rotation angle is registered in a database, the position correction for the transfer tool 403 is performed based on the database each time a semiconductor chip 402 is mounted on a work 404. <P>COPYRIGHT: (C)2012,JPO&INPIT |
