发明名称 FLEXIBLE PRINTED CIRCUIT BOARD INTEGRATED WITH REINFORCING PLATE, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD INTEGRATED WITH REINFORCING PLATE
摘要 <p>The purpose of the present invention is to provide a flexible printed circuit board integrated with a reinforcing plate and a method for manufacturing the flexible printed circuit board integrated with a reinforcing plate which are characterized in that defects such as bulging are not generated during reflow mounting even if a reinforcing plate is attached on a photosensitive resin composition. To attain the purpose of the present invention, the flexible printed circuit board integrated with a reinforcing plate has a structure formed by the following elements in the listed order: (A) a reinforcing plate (6), (B) an adhesive (5), (C) a film (4) formed by curing a photosensitive resin composition, and (D) a flexible printed circuit board (1).</p>
申请公布号 WO2012035857(A1) 申请公布日期 2012.03.22
申请号 WO2011JP65726 申请日期 2011.07.08
申请人 KANEKA CORPORATION;KIDO, MASAYOSHI;KOGISO, TETSUYA;SEKITO, YOSHIHIDE 发明人 KIDO, MASAYOSHI;KOGISO, TETSUYA;SEKITO, YOSHIHIDE
分类号 H05K1/02;C08G59/42;G03F7/004;G03F7/033;H05K3/28 主分类号 H05K1/02
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