发明名称 |
FLEXIBLE PRINTED CIRCUIT BOARD INTEGRATED WITH REINFORCING PLATE, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD INTEGRATED WITH REINFORCING PLATE |
摘要 |
<p>The purpose of the present invention is to provide a flexible printed circuit board integrated with a reinforcing plate and a method for manufacturing the flexible printed circuit board integrated with a reinforcing plate which are characterized in that defects such as bulging are not generated during reflow mounting even if a reinforcing plate is attached on a photosensitive resin composition. To attain the purpose of the present invention, the flexible printed circuit board integrated with a reinforcing plate has a structure formed by the following elements in the listed order: (A) a reinforcing plate (6), (B) an adhesive (5), (C) a film (4) formed by curing a photosensitive resin composition, and (D) a flexible printed circuit board (1).</p> |
申请公布号 |
WO2012035857(A1) |
申请公布日期 |
2012.03.22 |
申请号 |
WO2011JP65726 |
申请日期 |
2011.07.08 |
申请人 |
KANEKA CORPORATION;KIDO, MASAYOSHI;KOGISO, TETSUYA;SEKITO, YOSHIHIDE |
发明人 |
KIDO, MASAYOSHI;KOGISO, TETSUYA;SEKITO, YOSHIHIDE |
分类号 |
H05K1/02;C08G59/42;G03F7/004;G03F7/033;H05K3/28 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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