Method for forming via hole in printed circuit board,申请号KR20100089406-传众专利搜索

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发明名称	Method for forming via hole in printed circuit board
摘要
申请公布号	KR20120027674(A)	申请公布日期	2012.03.22
申请号	KR20100089406	申请日期	2010.09.13
申请人		发明人
分类号	H05K3/42;H05K3/04	主分类号	H05K3/42
代理机构		代理人
主权项
地址

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