| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is excellent in heat radiation and a method for manufacturing the semiconductor device which is excellent in heat radiation. <P>SOLUTION: A semiconductor device comprises: a semiconductor element 1; a heat radiation member 5; a die bonding pad 21 having an arrangement surface 211 on which the semiconductor element 1 is arranged and positioned between the semiconductor element 1 and the heat radiation member 5; a resin package 7 covering the semiconductor element 1, the heat radiation member 5, and the die bonding pad 21; and a lead for insertion mounting 22 connecting to the die bonding pad 21 and protruding from the resin package 7. <P>COPYRIGHT: (C)2012,JPO&INPIT |
