发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR LASER ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor laser element capable of accurately recognizing an alignment mark during a formation of a waveguide structure. <P>SOLUTION: The method for manufacturing the semiconductor laser element comprises: a step for forming an alignment mark 15 as recess portions 15a; a step for forming a diffraction grating 13a on a diffraction grating layer 13; a step for growing a clad layer 17 to embed the diffraction grating layer 13 and the alignment mark 15; a step for removing a part of the clad layer 17 formed on the alignment mark 15; and a step for forming a mesa-stripe structure 20 including the diffraction grating 13a on an element formation region 10b by using the alignment mark 15 serving as a positioning reference. Arsine and phosphine are supplied to a chamber in which a semiconductor substrate 10 is placed in growing the clad layer 17 before the clad layer 17 grows to substitute a part of P on a surface layer of inside of the alignment mark 15 with As and to reform the surface layer into a layer including InAsP. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012059842(A) 申请公布日期 2012.03.22
申请号 JP20100200263 申请日期 2010.09.07
申请人 SUMITOMO ELECTRIC IND LTD 发明人 TSUJI KOYO
分类号 H01S5/12;H01S5/227;H01S5/343 主分类号 H01S5/12
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