发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR LASER ELEMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor laser element capable of accurately recognizing an alignment mark during a formation of a waveguide structure. <P>SOLUTION: The method for manufacturing the semiconductor laser element comprises: a step for forming an alignment mark 15 as recess portions 15a; a step for forming a diffraction grating 13a on a diffraction grating layer 13; a step for growing a clad layer 17 to embed the diffraction grating layer 13 and the alignment mark 15; a step for removing a part of the clad layer 17 formed on the alignment mark 15; and a step for forming a mesa-stripe structure 20 including the diffraction grating 13a on an element formation region 10b by using the alignment mark 15 serving as a positioning reference. Arsine and phosphine are supplied to a chamber in which a semiconductor substrate 10 is placed in growing the clad layer 17 before the clad layer 17 grows to substitute a part of P on a surface layer of inside of the alignment mark 15 with As and to reform the surface layer into a layer including InAsP. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012059842(A) |
申请公布日期 |
2012.03.22 |
申请号 |
JP20100200263 |
申请日期 |
2010.09.07 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
TSUJI KOYO |
分类号 |
H01S5/12;H01S5/227;H01S5/343 |
主分类号 |
H01S5/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|