| 摘要 |
<P>PROBLEM TO BE SOLVED: To uniformly and efficiently cool a plurality of electronic components arranged in rows on a circuit board. <P>SOLUTION: A plurality of devices are arranged in rows on a circuit board 12. The devices are provided with heat sinks 21a to 21d. Cooling air A is circulated along the arrangement direction of the plurality of devices and the heat sinks 21a to 21d by fans. The heat sinks 21a to 21d are each provided with a plurality of flat plate-shaped fins 41 arranged in parallel along the circulation direction of the cooling air A. The plurality of fins 41 of the adjacent ones of the heat sinks 21a to 21d are arranged in a zigzag fashion so that the cooling air A having circulated between the adjacent fins 41 and 41 on the heat sinks 21a to 21d may collide with one of the fins 41 on one of the heat sinks 21 on the downstream side. <P>COPYRIGHT: (C)2012,JPO&INPIT |
