| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in thin film curability and gas permeability resistance while maintaining characteristics such as good heat resistance and optical transparency which are features of an epoxy resin and a silicone resin. <P>SOLUTION: The epoxy resin composition includes the following (A)-(D) components: (A) 100 pts.mass of a compound which has two or more epoxy groups in one molecule, or a silicone-modified epoxy compound shown by formula (1), (wherein R<SP POS="POST">1</SP>is a 1-20C monovalent hydrocarbon group, R<SP POS="POST">2</SP>is a N,N'-diglycidyl triazine group, X is a 1-61Si polysiloxane having R<SP POS="POST">2</SP>in the terminal, and a and b are an integer of 0-30, c is an integer of 0-10, and 1≤a+b+c≤70); (B) 10-100 pts.mass of a curing agent; (C) 0.01-50 pts.mass of a silane or a siloxane having two or more hydroxy groups or alkoxy groups in one molecule; and (D) 0.05-3 pts.mass of a curing catalyst. <P>COPYRIGHT: (C)2012,JPO&INPIT |
