| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component mounting method which can improve production efficiency by grasping from which wafer a component is taken out and mounted. <P>SOLUTION: When a CPU 10 determines that all components have been taken out from a wafer, a taken-out wafer ring 4 is put back to a magazine 8 and another wafer ring 4 is taken out from the magazine 8. The number of step of the taken-out wafer ring 4 is stored in a storage area A, a suction nozzle 5 takes out components from the wafer by sucking it, transfers the number of step stored in the storage area A to a storage area B in order to mount the components held by the suction nozzle 5 on a work 2. Comparing the number of step of a storage area C currently stored and the number of step transferred to and stored in the storage area B, when it is determined to be unmatched, a serial number of the work 2 being mounted is preserved in a file A of a RAM 11 with the number of step of the wafer ring 4 which is stored by transferring the number of the step of the storage area B to the storage area C as an index. <P>COPYRIGHT: (C)2012,JPO&INPIT |
