| 摘要 |
The invention provides a light-curable adhesive resin composition, which exhibits good adhesion to adherends, including not only thermoplastic resins such as PET or polyimide, but also metal oxides such as IZO and metals such as gold. As means for solving the problems, the inventive thiol group-containing adhesive resin composition contains (A) a urethane (meta-) acrylate oligomer having a weight average molecular weight (Mw) of 5,000-40,000, (B) a (meta-) acryloyl morpholine monomer, (C) a polythiol, and (D) a photopolymerization initiator, wherein the polythiol (C) has thiol groups in an amount of 0.4 equivalents or more per 1 equivalent of the total (meta-) acrylate groups contained in the thiol group-containing adhesive resin composition. |
