| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor optical device capable of increasing a bonding strength between an electrode pad and a BCB resin. <P>SOLUTION: The manufacturing method of the semiconductor optical device comprises: a resin layer formation step of forming a BCB resin region 4 on a semiconductor optical element 2 including a layer which generates, absorbs, or guides light; a plasma processing step of forming an irregularity on a surface 4a of the BCB resin region 4 by processing the surface 4a of the BCB resin region 4 by an inductively coupled plasma P1 generated from gas including an oxygen atom and then forming a silicon oxide film 6 on the surface 4a of the BCB resin region 4; and an electrode pad formation step of forming an electrode pad composed of a metal on the surface 4a of the BCB resin region 4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
