发明名称 MANUFACTURING METHOD FOR WIRING BOARD AND WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board which can restrain deformation and defection of a flying reed and which is improved in stability of a projection distance and accuracy of a tip position. <P>SOLUTION: A manufacturing method for a wiring board of a roll-to-roll method includes patterning a conductor layer on a base material 1 to form wiring 3 including a flying reed 3f projecting to a device hole 5b which penetrates the base material 1. The flying reed 3f is formed in no less than two processes, and at least in one of the processes, the conductor layer and the base material are penetrated to form an opening 5a to fix the tip position of the flying reed 3f within the region scheduled for the device hole 5b to be formed. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012059980(A) 申请公布日期 2012.03.22
申请号 JP20100202696 申请日期 2010.09.10
申请人 HITACHI CABLE LTD 发明人 ISAKA FUMIYA;IMAI NOBORU
分类号 H01L21/60 主分类号 H01L21/60
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