发明名称 |
ILLUMINATION SYSTEM AND METHOD OF MANUFACTURING MULTI-CHIP PACKAGE STRUCTURE FOR LIGHT EMITTING DIODES |
摘要 |
One embodiment of the invention provides an illumination system including a light-source supporting body and a power supporting body. The light-source supporting body has a first groove. At least a light-source module is received in the first groove. The power supporting body has second groove. At least a power module is received in the second groove. The light-source supporting body is detachably fixed on the power supporting body. Each light-source module includes a multichip package structure composed of a plurality of light-emitting chips, and each of the light-source modules and the power module are separated by the light-source supporting body and the power supporting body.
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申请公布号 |
US2012069567(A1) |
申请公布日期 |
2012.03.22 |
申请号 |
US201013322450 |
申请日期 |
2010.05.27 |
申请人 |
WU YU-CHAO;HONG-YUAN TECHNOLOGY CO. LTD. |
发明人 |
WU YU-CHAO |
分类号 |
F21V7/22;F21V29/00;H01L33/48 |
主分类号 |
F21V7/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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