发明名称 DISSECTION SPLITTING WITH OPTICAL PROXIMITY CORRECTION AND MASK RULE CHECK ENFORCEMENT
摘要 The present disclosure provides one embodiment of an integrated circuit (IC) design method. The method includes receiving an IC design layout having a plurality of main features; applying a main feature dissection to the main features of the IC design layout and generating sub-portions of the main features; performing an optical proximity correction (OPC) to the main features; performing a mask rule check (MRC) to a main feature of the IC design layout; and modifying one of the sub-portions of the main feature if the main feature fails the MRC.
申请公布号 US2012072874(A1) 申请公布日期 2012.03.22
申请号 US20100884442 申请日期 2010.09.17
申请人 CHIANG CHIA-PING;TANG YU-PO;CHIH MING-HUI;TSAI CHENG-KUN;WANG WEI-LONG;HUANG WEN-CHUN;LIU RU-GUN;GAU TSAI-SHENG;TSAI CHENG-LUNG;FENG JOSH J.H.;YEH BING-SYUN;HO JENG-SHIUN;KUO CHENG-CHENG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 CHIANG CHIA-PING;TANG YU-PO;CHIH MING-HUI;TSAI CHENG-KUN;WANG WEI-LONG;HUANG WEN-CHUN;LIU RU-GUN;GAU TSAI-SHENG;TSAI CHENG-LUNG;FENG JOSH J.H.;YEH BING-SYUN;HO JENG-SHIUN;KUO CHENG-CHENG
分类号 G06F17/50 主分类号 G06F17/50
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