发明名称 |
METHOD OF MANUFACTURING FPCB SUBSTRATE |
摘要 |
A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer. |
申请公布号 |
US2012066903(A1) |
申请公布日期 |
2012.03.22 |
申请号 |
US201113306811 |
申请日期 |
2011.11.29 |
申请人 |
LIU RUI-WU;LAI YUNG-WEI;LIOU SHING-TZA;ZHEN DING TECHNOLOGY CO., LTD.;FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD. |
发明人 |
LIU RUI-WU;LAI YUNG-WEI;LIOU SHING-TZA |
分类号 |
H05K3/42 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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