Packaging of MEMS microphone

摘要

A package (100) of microelectromechanical system (MEMS) microphone (120) is suitable for being mounted on a printed circuit board (200). The package (100) has a cover (110) and at least one MEMS microphone (120). The cover (110) has an inner surface (110') and a conductive trace (112) disposed thereon. The MEMS microphone (120) is mounted on the inner surface (110') of the cover (110) and electrically connected to the conductive trace (112), and has an acoustic pressure receiving surface (122). When the cover (110) is mounted on the printed circuit board (200), the cover (110) and the printed circuit board (200) construct or provide an acoustic housing (130) which has at least one acoustic hole (130a) passing through the cover or the printed circuit board, and the conductive trace on the inner surface of the cover is electrically connected to the printed circuit board.