| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method capable of mounting an electronic component with high strength without damaging a printed board, a soldering device, and a mounting substrate. SOLUTION: The soldering device is prepared comprising an injection unit 10 for pressing semi-molten solder 11 into a through-hole 3 of the printed board 2 and a heater 16 for keeping the solder heated in a solid and liquid coexistence temperature region (semi-molten state). After the lead 4 of the electronic component is inserted into the through-hole 3 of the printed board 2, the semi-molten solder 11 received from the heater 16 into an injection sleeve 13 is pushed out from a nozzle 12 by advancing a plunger 14 to be pressed into the through-hole 3, thereby preventing a rise in temperature of the printed board 2. The through-hole 3 is sufficiently filled with the solder 11, also a fillet 11' is formed on both front and rear faces of the printed board 2, and the lead 4 is rigidly joined with a land 7 around the through-hole 3. COPYRIGHT: (C)2008,JPO&INPIT |
