METHOD FOR CLEANING A MULTILAYER SUBSTRATE AND METHOD FOR BONDING SUBSTRATES AND METHOD FOR PRODUCING BONDED WAFER,申请号EP20040787664-传众专利搜索

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发明名称	METHOD FOR CLEANING A MULTILAYER SUBSTRATE AND METHOD FOR BONDING SUBSTRATES AND METHOD FOR PRODUCING BONDED WAFER
摘要
申请公布号	EP1667214(B1)	申请公布日期	2012.03.21
申请号	EP20040787664	申请日期	2004.09.07
申请人	SHIN-ETSU HANDOTAI CO., LTD.	发明人	YOKOKAWA, ISAO;MITANI, KIYOSHI
分类号	H01L21/304;H01L21/306;H01L21/762	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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