发明名称 |
Method of manufacturing a backside illumination solid imaging device |
摘要 |
<p>A wafer (10) for backside illumination type solid imaging device (100) has a plurality of pixels inclusive of a photoelectric conversion device (501) and a charge transfer transistor (60) at its front surface side and a light receiving surface (20a) at its back surface side, wherein said wafer (10) is a SOI wafer obtained by forming a given active layer (40) on a support substrate (20) made of C-containing p-type semiconductor material through an insulating layer (30).</p> |
申请公布号 |
EP2124251(B1) |
申请公布日期 |
2012.03.21 |
申请号 |
EP20090160746 |
申请日期 |
2009.05.20 |
申请人 |
SUMCO CORPORATION |
发明人 |
KURITA, KAZUNARI;OMOTE, SHUICHI |
分类号 |
H01L21/322;H01L27/12;H01L27/146 |
主分类号 |
H01L21/322 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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