发明名称 |
HEAT DISSIPATING MEMBER AND SEMICONDUCTOR DEVICE USING SAME |
摘要 |
Disclosed is a heat dissipating material which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating material contains (A) 100 parts by weight of a silicone gel cured by an addition reaction having a penetration of not less than 100 (according to ASTM D 1403), and (B) 500-2000 parts by weight of a heat conductive filler. Also disclosed is a semiconductor device comprising a heat-generating electronic component and a heat dissipating body, wherein the heat dissipating material is interposed between the heat-generating electronic component and the heat dissipating body. |
申请公布号 |
EP1983568(A4) |
申请公布日期 |
2012.03.21 |
申请号 |
EP20070707379 |
申请日期 |
2007.01.25 |
申请人 |
MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC |
发明人 |
TABEI, SHINGO;HOSHINO, CHISATO |
分类号 |
H01L23/373;C08L83/04;C08L83/05;C08L83/07;H01L23/42;H01L23/433 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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