| 摘要 |
A machine for slicing wafers of brittle material from an ingot in which the ingot to be sliced is secured for stepwise movement into the path of a rotating saw blade which moves through a slicing path perpendicular to the direction of movement of the ingot. The mounting means for the ingot includes a way table mounted on a fixed base for movement between a cutting position adjacent said saw blade and a clearance position away from the said saw blade. Positive stop means define the cutting position of the way table such that the ingot can be moved away from the saw and back to the saw with an accurate repositioning of the ingot in its cutting position. A variety of adjustable mounting means are provided to mount the ingot on the way table whereby the ingot may be oriented vertically, horizontally and axially for proper angle of cut.
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