Electronic system having field effect transistors and interconnect bumps on a semiconductor substrate

摘要

A method and system for a FET cell is presented. The FET cell includes multiple individual transistors and interconnect bumps that are configured to flip-chip connect to a substrate. The substrate may have the majority of a matching structure for the FET cell. Furthermore, the FET cell may include a stability circuit in communication with the terminals of the individual transistors and further in communication with the interconnect bumps. Additionally, different materials can be used in combination in the FET cell and the separate substrate having the majority of the matching structure. Various materials may be more efficiency used in a FET cell, while other materials are suitable for the separate substrate.