发明名称 |
Laminated electronic component and method for manufacturing the same |
摘要 |
A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles. |
申请公布号 |
US8139342(B2) |
申请公布日期 |
2012.03.20 |
申请号 |
US20090466393 |
申请日期 |
2009.05.15 |
申请人 |
TAKEUCHI SHUNSUKE;KAWASAKI KENICHI;MOTOKI AKIHIRO;OGAWA MAKOTO;IWANAGA TOSHIYUKI;MURATA MANUFACTURING CO., LTD. |
发明人 |
TAKEUCHI SHUNSUKE;KAWASAKI KENICHI;MOTOKI AKIHIRO;OGAWA MAKOTO;IWANAGA TOSHIYUKI |
分类号 |
H01G4/228 |
主分类号 |
H01G4/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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