发明名称 TCP-type semiconductor device and method of testing thereof
摘要 A TCP-type semiconductor device has: a base film; a semiconductor chip mounted on the base film; and a plurality of leads formed on the base film. Each lead has: a first terminal portion including a first end that is one end of the each lead and connected to the semiconductor chip; and a second terminal portion including a second end that is the other end of the each lead and located on the opposite side of the first terminal portion. I a terminal region including the second terminal portion of the each lead, the plurality of leads are parallel to each other along a first direction, the plurality of leads include a first lead and a second lead that are adjacent to each other, and the first lead and the second lead are different in a position of the second end in the first direction.
申请公布号 US8138777(B2) 申请公布日期 2012.03.20
申请号 US20090588460 申请日期 2009.10.15
申请人 SASAKI SUGURU;RENESAS ELECTRONICS CORPORATION 发明人 SASAKI SUGURU
分类号 G01R31/00;G01R31/26 主分类号 G01R31/00
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