发明名称 |
CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME |
摘要 |
The circuit connecting material of the invention is a circuit connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and second circuit electrode laid facing each other, the circuit connecting material comprising a curing agent that generates free radicals, a radical polymerizing substance and a compound containing secondary thiol group. The circuit connecting material of the invention is capable of low-temperature rapid curing and has excellent storage stability. |
申请公布号 |
KR20120027061(A) |
申请公布日期 |
2012.03.20 |
申请号 |
KR20127005038 |
申请日期 |
2008.08.29 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
NAKAZAWA TAKASHI;ARIFUKU MOTOHIRO;KOJIMA KAZUYOSHI;MOCHIZUKI NICHIOMI |
分类号 |
H01R12/55;H01R4/04;H01R11/01;H01R11/11 |
主分类号 |
H01R12/55 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|