| 摘要 |
PURPOSE: A system and method for recycling waste slurry in a cutting process of a silicon wafer are provided to improve productivity by efficiently removing particles from abrasives with a stirring process, a softening process, a first ultrasonic cleaning process, and a second ultrasonic cleaning process. CONSTITUTION: Waste slurry is stirred by rotating a stir wing(S100). The waste slurry is indirectly heated for softening the waste slurry(S102). The waste slurry is firstly cleaned with an ultrasonic wave(S104). Cutting oil is separated from powder(S106). Wet powder are obtained by secondly cleaning the powder with a second ultrasonic wave(S108). The wet powder is dried(S110). An aggregate generated in drying the wet powder is disintegrated into dry powder(S112). Recycled abrasives are obtained by distributing the dried powder(S114).
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