METHOD FOR MANUFACTURING CHIP EMBEDDED PCB

摘要

PURPOSE: A method for manufacturing a chip embedded printed circuit board is provided stably mount components by forming a structure mixed with resin and ceramic in a hot press process. CONSTITUTION: A cavity passing through a core layer is formed(S120). A first prepreg is tack-welded with the lower side of the core layer(S130). The cavity is filled with ceramic ink(S140). A ceramic layer is plasticized by thermally processing a component after the component is inserted into the cavity(S150). A second prepreg is tack-welded with the upper side of the core layer(S160).