| 发明名称 |
Integrated circuit package system with multi-planar paddle |
| 摘要 |
An integrated circuit package system includes a multi-planar paddle having an uplift rim and an attached integrated circuit over the uplift rim of the multi-planar paddle. |
| 申请公布号 |
US8138586(B2) |
申请公布日期 |
2012.03.20 |
| 申请号 |
US20060381684 |
申请日期 |
2006.05.04 |
| 申请人 |
STATS CHIPPAC LTD. |
发明人 |
TRASPORTO ARNEL;WONG SZE MIN;BATHAN HENRY D.;CAMACHO ZIGMUND RAMIREZ |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
