MAKING METHOD FOR RIGID FLEXIBLE PRINTED CIRCUIT BOARD
摘要
PURPOSE: A method for manufacturing a rigid flexible PCB(Printed Circuit Board) is provided to improve the alignment ratio of a rigid flexible substrate by inserting a fixed pattern into a fixing hole. CONSTITUTION: A rigid part(110) is prepared for manufacturing a rigid flexible PCB(Printed Circuit Board). Primary conductive layers(120) are respectively laminated on top and lower parts of the rigid part. A predetermined fixed pattern is formed by etching the primary conductive layer. A first window having a fixed size is processed at the rigid part. The rigid parts are laminated on the top and lower parts of a flexible part(130). Prepreg layers(140) are respectively laminated on top parts of the top and lower parts of the rigid part at the flexible part. The prepreg layer is used for fixing a second conductor layer(150).
申请公布号
KR20120026827(A)
申请公布日期
2012.03.20
申请号
KR20100088976
申请日期
2010.09.10
申请人
KOREA CIRCUIT CO., LTD.
发明人
KWAN, JONG SANG;KIM, DAE HOON;JEON, GAB JUNG;PARK, JUNG KI;LIM, CHUL HONG