发明名称 Heat transport apparatus and heat transport apparatus manufacturing method
摘要 A heat transport device having a composite structure that is readily manufactured and a method for manufacturing such a heat transport device are provided. The heat transport device includes a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force; a second base plate having a face provided with a first concavity functioning as a vaporization chamber for vaporizing the working fluid, a second concavity functioning as a liquefaction chamber for liquefying the working fluid, a first ditch for transporting the vaporized working fluid, a second ditch for transporting the liquefied working fluid, the second base plate comprising a material having a thermal conductivity lower than that of silicon; and a thermoplastic or thermosetting resin material for bonding the first and second base plates. The heat transport device can be readily manufactured by heating the first and second base plates sandwiching a thermoplastic or thermosetting resin material therebetween.
申请公布号 US8136581(B2) 申请公布日期 2012.03.20
申请号 US20050538296 申请日期 2005.06.10
申请人 TONOSAKI MINEHIRO;KATO EISAKU;YAJIMA MASAKAZU;YAJIMA TAKASHI;SONY CORPORATION 发明人 TONOSAKI MINEHIRO;KATO EISAKU;YAJIMA MASAKAZU;YAJIMA TAKASHI
分类号 F28D15/00;F28D15/02;F28D15/04;H01L23/427;H05K7/20 主分类号 F28D15/00
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