| 摘要 |
<p>The soldering nozzle for soldering joints on large surfaces of printed circuits, through which liquid solder is pumped upwards resulting in the formation of a wave of liquid solder through which the workpieces are moved, is fitted in its rectangular bore with a deflector baffle sheet, which deflects the bulk of the solder counter current wise against the workpiece movement direction and a smaller proportion in the direction of workpiece movement. Behind the nozzle - in relation to the workpiece movement - is provided another deflector, inclined in the opposite direction to the first deflector, which is located sufficiently far from the nozzle to effect the formation of a definite tear-off edge of the displaced solder. The second deflector ensures, that no bridging between joints takes place or that icicle type projections occur.</p> |
