发明名称 Method and system of linking on-chip parasitic coupling capacitance into distributed pre-layout passive models
摘要 A method of linking on-chip parasitic coupling capacitance into distributed pre-layout passive models such as distributed transmission line models and on-chip spiral inductor models includes recognizing a passive device such as a distributed transmission line device and an on-chip spiral inductor device, interpreting data obtained from the recognizing the passive device, breaking the passive device into a plurality of sections, the plurality of sections including a terminal of a model call, extracting parameters of the passive device by Layout Versus Schematic (LVS) and parasitic extraction, connecting the terminal to a pre-layout passive network by selectively low and high resistive paths set by the parameters of the passive device depending on whether crossing lines are present or not present in one of the plurality of sections, connecting the terminal to a distributed passive model, and coupling the crossing lines to the terminal via capacitors produced in an extracted netlist with the passive device having distributed coupling to a plurality of crossing lines.
申请公布号 US8141013(B2) 申请公布日期 2012.03.20
申请号 US20090494723 申请日期 2009.06.30
申请人 WOODS WAYNE H.;ZEMKE COLE E.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 WOODS WAYNE H.;ZEMKE COLE E.
分类号 G06F17/50 主分类号 G06F17/50
代理机构 代理人
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