发明名称 |
Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate |
摘要 |
An attaching device which makes it possible to accurately perform alignment when the diameters of a substrate and a supporting plate are substantially the same includes a mounting plate for mounting a semiconductor wafer thereon, a pressing plate for pressing a supporting plate onto the semiconductor wafer, and a pair of alignment members. The pair of alignment members are arranged to freely move back and forth in a horizontal direction, and blades for supporting a lower surface of the periphery of the supporting plate and pushing members for performing positioning in a state where the supporting plate is superposed on the semiconductor wafer are provided at tip ends of the alignment members. |
申请公布号 |
US8136564(B2) |
申请公布日期 |
2012.03.20 |
申请号 |
US20060633604 |
申请日期 |
2006.12.04 |
申请人 |
NAKAMURA AKIHIKO;MIYANARI ATSUSHI;INAO YOSHIHIRO;TOKYO OHKA KOGYO CO., LTD. |
发明人 |
NAKAMURA AKIHIKO;MIYANARI ATSUSHI;INAO YOSHIHIRO |
分类号 |
B32B37/10 |
主分类号 |
B32B37/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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