| 摘要 |
A method of manufacturing parts of a first material able to be etched from a substrate including at least one superficial layer of the first material, includes (a) forming a substantially uniform superficial layer of a second material at the surface of the superficial layer of the first material, wherein the second material resists a selective etch of the first material, (b) forming a bead of second material at the periphery of the superficial layer of second material, (c) structuring the layer of second material and the bead by a photolithographic process including an etch step of sufficient duration to etch the superficial layer of second material over the entire thickness thereof, but insufficient to etch the bead over the entire thickness thereof, so as to obtain a mask, and (d) cutting out parts made of the first material through the mask of the second material, by directional etching. |
