发明名称 |
RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE |
摘要 |
Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor. |
申请公布号 |
KR20120026573(A) |
申请公布日期 |
2012.03.19 |
申请号 |
KR20117031243 |
申请日期 |
2010.05.28 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
WADA MASAHIRO |
分类号 |
C08G59/62;C08K3/00;C08L63/00;H01L23/29 |
主分类号 |
C08G59/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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