| 摘要 |
PURPOSE: An adhesive stamping device of an LED bonder is provided to shorten an LED bonding time and an adhesive stamping time by including a plurality of stamping tools. CONSTITUTION: A tool support unit is rotatably installed in an installation hole and includes a plurality of combination holes. A plurality of stamping tools(124) are installed at each combination hole of the tool support unit to be lifted. A plurality of return springs are combined with the plurality of stamp tools to support the stamp tool upward. A pressing unit(141) is arranged on the upper side of the plurality of stamp tools to be lifted. The pressing unit has a penetration hole through which the remaining stamp tools except for the pressed stamp tools penetrate. A pressing unit actuator(150) is combined with the pressing unit to lift the pressing unit. |
