发明名称 |
BONDING TUNGSTEN WITH A FUGITIVE ALLOY BINDER |
摘要 |
A method of forming a tungsten-to-tungsten joint which comprises depositing on at least one of the faying surfaces a thin film, foil or coating of an alloy consisting essentially of, in weight percent, 55-75 percent nickel, balance iron, pressing the faying surfaces together, heating the joint area to just above the melting point of the alloy in an inert atmosphere to produce a joint which has a remelt temperature approximating the melting point of the tungsten-base metal.
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申请公布号 |
US3707763(A) |
申请公布日期 |
1973.01.02 |
申请号 |
USD3707763 |
申请日期 |
1971.07.01 |
申请人 |
ATOMIC ENERGY COMMISSION,US |
发明人 |
BINKLEY N,US;HAMMOND J,US |
分类号 |
B23K35/00;B23K35/30;(IPC1-7):B23K31/02;B23K35/24 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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