发明名称 BONDING TUNGSTEN WITH A FUGITIVE ALLOY BINDER
摘要 A method of forming a tungsten-to-tungsten joint which comprises depositing on at least one of the faying surfaces a thin film, foil or coating of an alloy consisting essentially of, in weight percent, 55-75 percent nickel, balance iron, pressing the faying surfaces together, heating the joint area to just above the melting point of the alloy in an inert atmosphere to produce a joint which has a remelt temperature approximating the melting point of the tungsten-base metal.
申请公布号 US3707763(A) 申请公布日期 1973.01.02
申请号 USD3707763 申请日期 1971.07.01
申请人 ATOMIC ENERGY COMMISSION,US 发明人 BINKLEY N,US;HAMMOND J,US
分类号 B23K35/00;B23K35/30;(IPC1-7):B23K31/02;B23K35/24 主分类号 B23K35/00
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