发明名称 |
ADHESIVE FOR BONDING SEMICONDUCTOR, ADHESIVE FILM FOR BONDING SEMICONDUCTOR, METHOD FOR MOUNTING SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive for bonding a semiconductor which has high transparency and high bonding reliability, an adhesive film for bonding the semiconductor manufactured by using the adhesive for bonding the semiconductor, a method for mounting a semiconductor chip using the adhesive for bonding the semiconductor, and a semiconductor device manufactured by using the method for mounting the semiconductor chip. <P>SOLUTION: An adhesive for bonding the semiconductor comprises: a epoxy resin; a high polymer having a functional group reacting with the epoxy resin; a curing agent; and a stress reliever. The stress reliever comprising a core layer composed of rubber component and a shell layer composed of acrylic resin is a core shell grain having an average particle size of 0.1 to 2 μm, and the content of the stress reliever is 1 to 20 wt%. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012054518(A) |
申请公布日期 |
2012.03.15 |
申请号 |
JP20100198116 |
申请日期 |
2010.09.03 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
WAKIOKA SAYAKA;RI YOSHU;NISHIMURA YOSHIO;NAKAYAMA ATSUSHI |
分类号 |
H01L21/52;C09J7/02;C09J11/06;C09J163/00;C09J201/00;H01L21/301;H01L21/304;H01L21/60;H01L23/29;H01L23/31 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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