发明名称 FILM DEPOSITION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide film deposition equipment which can increase its throughput while preventing an excessive increase in number of auxiliary devices and footprint thereof. <P>SOLUTION: Film deposition equipment comprises: a rotary table including 10 or more placing areas, each having a substrate with a diameter of 300 mm placed; a first reaction gas supply section disposed in a first region in a container, for supplying a first reaction gas to the rotary table; a second reaction gas supply section disposed in a second region separated from the first region in a rotational direction of the rotary table, for supplying a second reaction gas to the rotary table; first and second exhaust outlets corresponding to the first region and the second region, respectively; a separation gas supply section disposed between the first region and the second region, for discharging a separation gas for separating the first and second reaction gases; and a separation region including a ceiling surface defining a space in which the separation gas supplied from the separation gas supply section is flowed, between itself and the rotary table, the ceiling surface having a height so that the pressure of the space can be kept higher than that of the pressure in the first region and the second region. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012054508(A) 申请公布日期 2012.03.15
申请号 JP20100197953 申请日期 2010.09.03
申请人 TOKYO ELECTRON LTD 发明人 KATO HISASHI;OKABE YASUYUKI;HONMA MANABU;KUMAGAI TAKESHI;TAKEUCHI YASUSHI
分类号 H01L21/31;C23C16/455 主分类号 H01L21/31
代理机构 代理人
主权项
地址