NEW PHOSPHORUS ATOM-CONTAINING PHENOL RESIN AND METHOD FOR PRODUCING THE SAME, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, RESIN COMPOSITION FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, RESIN COMPOSITION FOR FLEXIBLE WIRING BOARD, RESIN COMPOSITION FOR SEMICONDUCTOR SEALING MATERIAL, AND RESIN COMPOSITION FOR INTERLAYER INSULATING MATERIAL FOR BUILDUP SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a new phosphorus atom-containing phenol resin and a curable resin composition, which are excellent in flame retardancy and heat resistance and can achieve an extremely low thermal expansion coefficient.

SOLUTION: The new phosphorus atom-containing phenol resin is obtained by polycondensing a phosphorus atom-containing phenolic compound having a structure represented by a formula (wherein the biphenyl skeleton may be substituted by two phenyl groups) or a derivative thereof and a naphthol compound with formaldehyde. An epoxy resin composition using the phenol resin as a curing agent is provided.

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