<p>In various embodiments of the present invention, a thermoelectric cooling device with modular thermoelectric devices is provided to cool a fluid. A hot side of preferably each modular thermoelectric device is attached to a plate made of a metallic material which transfers the heat to a heat sink. In an embodiment, a heat pipe is embedded into the plate. The cold side of preferably each modular thermoelectric device is connected to a chamber containing the fluid through a metal standoff. The heat sink is connected to the modular thermoelectric devices by means of screws or conductive epoxy material.</p>
